Thin Wafer Processing and Dicing Equipment Market – Global Industry Insights, Market Size Estimation and Growth Forecast, By Application – (MEMS, Logic and Memory, Power Device, CMOS Image Sensor, and RFID), By Wafer Thickness – (750 micrometer, 120 micrometer, and 50 micrometer), By Dicing Technology – (Blade Dicing, Laser Dicing, and Plasma Dicing) & By Regions, 2017 – 2025

Thin Wafer Processing and Dicing Equipment Market Report Code: SE-101-031518 | Category: Semiconductors and Electronics
Format: pdf file iconexcel file iconPPT File Image | No. of Slides: 168 | No. of Figures: 63 | No. of Tables: 46


Thin Wafer Processing and Dicing Equipment Market Interviews Breakdown
Thin Wafer Processing and Dicing Equipment Market Primary Interviews Breakdown

Report Description

The market for thin wafer processing and dicing equipment has been covered under the scope of this report. Thin wafer processing and dicing equipment is expected to witness strong growth during the forecast period. This is mainly due to thin wafer processing and dicing equipment manufacturers are continuously focusing on expanding their production units in across different part of the globe, which in turn is anticipated to be a major driving factor for the global thin wafer processing and dicing equipment market.

 

Thin Wafer Processing and Dicing Equipment Market Segments

The global thin wafer processing and dicing equipment market has been segmented on the basis of:

  1. Application
  2. Wafer thickness
  3. Dicing technology, and
  4. Region

It also provides a cross sectional analysis of the thin wafer processing and dicing equipment market across different regional segments such as Asia-Pacific, Europe, North America, Asia-Pacific (APAC), Middle-East & Africa (MEA) and South America under its scope. Attributes such as better electrical performance, improved form factor due to thin packaging and reduced cost of manufacturing a device obtained by using thin wafer is the primary factor responsible for the growing demand for thin and ultrathin wafers during the forecast period from 2017 to 2025.

Thin Wafer Processing and Dicing Equipment Market Size
Thin Wafer Processing and Dicing Equipment Market Size
 

Scope of the Report

A complete analysis of market dynamics, which include the market drivers, restraints and opportunities, is included under the scope of the report. Market dynamics for the different segments, namely application, wafer thickness and dicing technology, have been covered separately, under the purview of the report. Additionally, the country level trend for each region has also been covered under the scope of the report. Thus, this report provides an exhaustive study of the global thin wafer processing and dicing equipment market and also provides the forecast of the market for the period from 2017 – 2025.


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High-level Analysis Covered In the Report

Under the scope of the report on global thin wafer processing and dicing equipment market, several high-level analyses have been covered. This includes:

  1. The product-market trend analysis
  2. Product lifecycle analysis
  3. Porter’s five forces analysis, and
  4. Market attractiveness analysis

Key trends analysis discusses the current and upcoming trends of this market. Product lifecycle analysis analyzes the current lifecycle stage of the product in the five wide geographic regions, such as whether the product is approaching maturity in a region or whether it is a new entrant etc. Porter’s five forces analysis provides insights on the competitive scenario, with regards to new entrants, substitutes, buyers and suppliers. For providing a detailed insight into the global thin wafer processing and dicing equipment market, the market attractive analysis has been provided in the report. Market attractiveness analysis details the investment attractiveness, by application, wafer thickness and dicing technology and geography.

Thin Wafer Processing and Dicing Equipment Market Revenue
Thin Wafer Processing and Dicing Equipment Market Revenue Forecast
 

The Competitive Profiling

The competitive profiling of the key players in the global thin wafer processing and dicing equipment market and their business segments has been exhaustively covered under the purview of the study. Moreover, key business strategies adopted by the leading players in the market have also been covered under the scope of the report.

 

Key Competitors in the Thin Wafer Processing and Dicing Equipment Market

The leading operating in the thin wafer processing and dicing equipment industry included:

  • EV Group (Austria)
  • Lam Research Corp (The U.S), Plasma-Therm LLC (The U.S)
  • DISCO Corp.(Japan), Tokyo Electron Ltd.(Japan), Tokyo Seimitsu Co. Ltd.(Japan), and Panasonic Corp.(Japan)
  • Advanced Dicing Technologies (Israel)
  • Suzhou Delphi Laser Co. Ltd.(China)
  • SPTS Technologies Ltd. (U.K) among others.

 

Report Highlights

  • Impeccable insights related to relevant segment of the market.
  • In depth analysis of key trends of the market.
  • In-depth analysis of the competitive landscape and competitor behavior in the market.
  • Major push factors that will affect the growth of the market.
  • Growth possibilities in different segments of the market till 2025.
  • Key strategies implemented by the market leaders to sustain growth in the market.
  • Major restraining factor of the market.
  • Ways to generate new revenue streams.

 

The Thin Wafer Processing and Dicing Equipment Market has been segmented as follows:

Thin Wafer Processing and Dicing Equipment Market: By Application

  • Logic and Memory
  • Micro Electro Mechanical Systems (MEMS)
  • Power Device
  • Radio Frequency Identification (RFID)
  • CMOS Image Sensor

Thin Wafer Processing and Dicing Equipment Market: By Wafer Thickness

  • 750 Micrometer
  • 120 Micrometer
  • 50 Micrometer

Thin Wafer Processing and Dicing Equipment Market: By Dicing Technology

  • Blade Dicing
  • Laser Dicing
  • Plasma Dicing

Thin Wafer Processing and Dicing Equipment Market: By Geography

  • North America (U.S. and Canada)
  • Europe (U.K., Germany, France, CIS + Scandinavia and Rest of Europe)
  • Asia-Pacific (China, Japan, Taiwan, South Korea and Rest of Asia-Pacific)
  • Middle East & Africa (Israel, South Africa and Rest of Middle East & Africa)
  • South America (Brazil, Mexico and Rest of South America)

Table of Content

  1. Introduction
    • Study Objective
    • Assumption
    • Acronyms Used
    • Stakeholder Analysis, Mendelow's Matrix
    • Research Scope
    • Market Segmentation
    • Research Limitations
  2. Research Methodology
    • Parameters
    • Data Sources
      • Primary Data Sources
        • Primary Interviews Breakdown, By Geography
        • Primary Interviews Breakdown, By Designation
      • Research Process
        • Primary data collection process
        • Primary data sources
        • Secondary data collection process
        • Secondary data sources
      • Market Size Estimation Technique
        • Top Down Approach
        • Bottom Up Approach
        • Forecasting Technique
  1. Executive Summary
    • Market Size (Value and Volume), By Application, 2016 Vs. 2025
    • Market Size (Value and Volume), By Wafer Thickness, 2016 Vs. 2025
    • Market Size (Value and Volume), By Dicing Technology, 2016 Vs. 2025
    • Market Size (Value and Volume), By Region, 2016 Vs. 2025
  2. Market Overview
    • Market Definition
      • By Application
      • By Wafer Thickness
      • By Dicing Technology
    • Key Trends
    • Product Lifecycle
    • Porter’s Five Forces Analysis
    • Market Attractiveness Analysis
  3. Global Thin Wafer Processing and Dicing Equipment Market– Competitive Scenario
    • Production Capacity Share of Key Players
    • Competitive Strategies Adopted by Leading Players
    • List of Growth Activities
      • Organic Growth Activities
      • Inorganic Growth Activities
    • Customer Group Benchmarking
    • Vendor Positioning Matrix
  4. Global Thin Wafer Processing and Dicing Equipment Market– By Application
    • Overview – By Application
    • Key Trends
    • Market Dynamics, By Application
      • Drivers
      • Restraints
      • Opportunities
    • Market Opportunity Heat Map, By Application
    • Logic and Memory
    • Micro Electro Mechanical Systems (MEMS)
    • Power Device
    • Radio Frequency Identification (RFID)
    • CMOS Image Sensor
  5. Global Thin Wafer Processing and Dicing Equipment Market– By Wafer Thickness
    • Overview –By Wafer Thickness
    • Key Trends
    • Market Dynamics, By Wafer Thickness
      • Drivers
      • Restraints
      • Opportunities
    • Market Opportunity Heat Map, By Wafer Thickness
    • 750 Micrometer
    • 120 Micrometer
    • 50 Micrometer
  6. Global Thin Wafer Processing and Dicing Equipment Market– By Dicing Technology
    • Overview – By Dicing Technology
    • Key Trends
    • Market Dynamics, By Dicing Technology
      • Drivers
      • Restraints
      • Opportunities
    • Market Opportunity Heat Map, By Dicing Technology
    • Blade Dicing
    • Laser Dicing
    • Plasma Dicing
  7. North America Thin Wafer Processing and Dicing Equipment Market
    • North America Market: Overview
    • North America Market: By Application
    • North America Market: By Wafer Thickness
    • North America Market: By Dicing Technology
    • North America Market: By Country
  8. Europe Thin Wafer Processing and Dicing Equipment Market
    • Europe Market: Overview
    • Europe Market: By Application
    • Europe Market: By Wafer Thickness
    • Europe Market: By Dicing Technology
    • Europe Market: By Country
  9. Asia-Pacific Thin Wafer Processing and Dicing Equipment Market
    • Asia-Pacific Market: Overview
    • Asia-Pacific Market: By Application
    • Asia-Pacific Market: By Wafer Thickness
    • Asia-Pacific Market: By Dicing Technology
    • Asia-Pacific Market: By Country
  10. Middle East & Africa Thin Wafer Processing and Dicing Equipment Market
    • Middle East & Africa Market: Overview
    • Middle East & Africa Market: By Application
    • Middle East & Africa Market: By Wafer Thickness
    • Middle East & Africa Market: By Dicing Technology
    • Middle East & Africa Market: By Country
  11. South America Thin Wafer Processing and Dicing Equipment Market
    • South America Market: Overview
    • South America Market: By Application
    • South America Market: By Wafer Thickness
    • South America Market: By Dicing Technology
    • South America Market: By Country
  12. Company Profiles
    • EV Group
      • Business Overview
      • Company Description
      • Primary Business Segments
      • SWOT Analysis
      • Strategy Mapping
      • Financial Overview
    • Lam Research Corp.
      • Business Overview
      • Company Description
      • Primary Business Segments
      • SWOT Analysis
      • Strategy Mapping
      • Financial Overview
    • Plasma-Therm, LLC
      • Business Overview
      • Company Description
      • Primary Business Segments
      • SWOT Analysis
      • Strategy Mapping
      • Financial Overview
    • DISCO Corp.
      • Business Overview
      • Company Description
      • Primary Business Segments
      • SWOT Analysis
      • Strategy Mapping
      • Financial Overview
    • Tokyo Electron Ltd.
      • Business Overview
      • Company Description
      • Primary Business Segments
      • SWOT Analysis
      • Strategy Mapping
      • Financial Overview
    • Advanced Dicing Technologies
      • Business Overview
      • Company Description
      • Primary Business Segments
      • SWOT Analysis
      • Strategy Mapping
      • Financial Overview
    • SPTS Technologies Ltd.
      • Business Overview
      • Company Description
      • Primary Business Segments
      • SWOT Analysis
      • Strategy Mapping
      • Financial Overview
    • Suzhou Delphi Laser Co. Ltd
      • Business Overview
      • Company Description
      • Primary Business Segments
      • SWOT Analysis
      • Strategy Mapping
      • Financial Overview
    • Panasonic Corporation 
      • Business Overview
      • Company Description
      • Primary Business Segments
      • SWOT Analysis
      • Strategy Mapping
      • Financial Overview
    • Tokyo Seimitsu Co. Ltd.
      • Business Overview
      • Company Description
      • Primary Business Segments
      • SWOT Analysis
      • Strategy Mapping
      • Financial Overview

 

List of Figures

Fig 01 Vendor Positioning Matrix

Fig 02 Market Attractiveness, By Geography (2016)

Fig 03 Market Attractiveness, By Application (2016)

Fig 04 Market Attractiveness, By Wafer Thickness (2016)

Fig 05 Market Attractiveness, By Dicing Technology (2016)

Fig 06 Production Capacity Share of Key Players (2017)

Fig 07 Global Revenue Forecast (USD Million): By Application (2016 Vs 2025)

Fig 08 Global Volume Forecast (Units): By Application (2016 Vs 2025)

Fig 09 Logic and Memory - Revenue and Volume Forecast

Fig 10 Micro Electro Mechanical Systems (MEMS) - Revenue and Volume Forecast

Fig 11 Power Device - Revenue and Volume Forecast

Fig 12 Radio Frequency Identification (RFID)- Revenue and Volume Forecast

Fig 13 CMOS Image Sensor- Revenue and Volume Forecast

Fig 14 Global Revenue Forecast (USD Million): By Wafer Thickness (2016 Vs 2025)

Fig 15 Global Volume Forecast (Units): By Wafer Thickness (2016 Vs 2025)

Fig 16 750 micrometer - Revenue and Volume Forecast

Fig 17 120 micrometer - Revenue and Volume Forecast

Fig 18 50 micrometer - Revenue and Volume Forecast

Fig 19 Global Revenue Forecast (USD Million): By Dicing Technology (2016 Vs 2025)

Fig 20 Global Volume Forecast (Units): By Dicing Technology (2016 Vs 2025)

Fig 21 Blade Dicing - Revenue and Volume Forecast

Fig 22 Laser Dicing - Revenue and Volume Forecast

Fig 23 Plasma Dicing - Revenue and Volume Forecast

Fig 24 North America Revenue Forecast (USD Million): By Application

Fig 25 North America Volume Forecast (Units): By Application

Fig 26 North America Revenue Forecast (USD Million): By Wafer Thickness

Fig 27 North America Volume Forecast (Units): By Wafer Thickness

Fig 28 North America Revenue Forecast (USD Million): By Dicing Technology

Fig 29 North America Volume Forecast (Units): By Dicing Technology

Fig 30 North America Revenue Forecast (USD Million): By Country

Fig 31 North America Volume Forecast (Units): By Country

Fig 32 Europe Revenue Forecast (USD Million): By Application

Fig 33 Europe Volume Forecast (Units): By Application

Fig 34 Europe Revenue Forecast (USD Million): By Wafer Thickness

Fig 35 Europe Volume Forecast (Units): By Wafer Thickness

Fig 36 Europe Revenue Forecast (USD Million): By Dicing Technology

Fig 37 Europe Volume Forecast (Units): By Dicing Technology

Fig 38 Europe Revenue Forecast (USD Million): By Country

Fig 39 Europe Volume Forecast (Units): By Country

Fig 40 Asia-Pacific Revenue Forecast (USD Million): By Application

Fig 41 Asia-Pacific Volume Forecast (Units): By Application

Fig 42 Asia-Pacific Revenue Forecast (USD Million): By Wafer Thickness

Fig 43 Asia-Pacific Volume Forecast (Units): By Wafer Thickness

Fig 44 Asia-Pacific Revenue Forecast (USD Million): By Dicing Technology

Fig 45 Asia-Pacific Volume Forecast (Units): By Dicing Technology

Fig 46 Asia-Pacific Revenue Forecast (USD Million): By Country

Fig 47 Asia-Pacific Volume Forecast (Units): By Country

Fig 48 Middle East & Africa Revenue Forecast (USD Million): By Application

Fig 49 Middle East & Africa Volume Forecast (Units): By Application

Fig 50 Middle East & Africa Revenue Forecast (USD Million): By Wafer Thickness

Fig 51 Middle East & Africa Volume Forecast (Units): By Wafer Thickness

Fig 52 Middle East & Africa Revenue Forecast (USD Million): By Dicing Technology

Fig 53 Middle East & Africa Volume Forecast (Units): By Dicing Technology

Fig 54 Middle East & Africa Revenue Forecast (USD Million): By Country

Fig 55 Middle East & Africa Volume Forecast (Units): By Country

Fig 56 South America Revenue Forecast (USD Million): By Application

Fig 57 South America Volume Forecast (Units): By Application

Fig 58 South America Revenue Forecast (USD Million): By Wafer Thickness

Fig 59 South America Volume Forecast (Units): By Wafer Thickness

Fig 60 South America Revenue Forecast (USD Million): By Dicing Technology

Fig 61 South America Volume Forecast (Units): By Dicing Technology

Fig 62 South America Revenue Forecast (USD Million): By Country

Fig 63 South America Volume Forecast (Units): By Country

 

List of Tables

Table 01 Customer Group Benchmarking

Table 02 Market Opportunity Heat Map, By Type

Table 03 Comparative Analysis of Vendors

Table 04 Market Opportunity Heat Map, By Application

Table 05 Market Opportunity Heat Map, By Wafer Thickness

Table 06 Market Opportunity Heat Map, By Dicing Technology

Table 07 North America Market, By Application: Revenue Forecast (USD Million)

Table 08 North America Market, By Application: Volume Forecast (Units)

Table 09 North America Market, By Wafer Thickness: Revenue Forecast (USD Million)

Table 10 North America Market, By Wafer Thickness: Volume Forecast (Units)

Table 11 North America Market, By Dicing Technology: Revenue Forecast (USD Million)

Table 12 North America Market, By Dicing Technology: Volume Forecast (Units)

Table 13 North America Market, By Country: Revenue Forecast (USD Million)

Table 14 North America Market, By Country: Volume Forecast (Units)

Table 15 Europe Market, By Application: Revenue Forecast (USD Million)

Table 16 Europe Market, By Application: Volume Forecast (Units)

Table 17 Europe Market, By Wafer Thickness: Revenue Forecast (USD Million)

Table 18 Europe Market, By Wafer Thickness: Volume Forecast (Units)

Table 19 Europe Market, By Dicing Technology: Revenue Forecast (USD Million)

Table 20 Europe Market, By Dicing Technology: Volume Forecast (Units)

Table 21 Europe Market, By Country: Revenue Forecast (USD Million)

Table 22 Europe Market, By Country: Volume Forecast (Units)

Table 23 Asia-Pacific Market, By Application: Revenue Forecast (USD Million)

Table 24 Asia-Pacific Market, By Application: Volume Forecast (Units)

Table 25 Asia-Pacific Market, By Wafer Thickness: Revenue Forecast (USD Million)

Table 26 Asia-Pacific Market, By Wafer Thickness: Volume Forecast (Units)

Table 27 Asia-Pacific Market, By Dicing Technology: Revenue Forecast (USD Million)

Table 28 Asia-Pacific Market, By Dicing Technology: Volume Forecast (Units)

Table 29 Asia-Pacific Market, By Country: Revenue Forecast (USD Million)

Table 30 Asia-Pacific Market, By Country: Volume Forecast (Units)

Table 31 Middle East & Africa Market, By Application: Revenue Forecast (USD Million)

Table 32 Middle East & Africa Market, By Application: Volume Forecast (Units)

Table 33 Middle East & Africa Market, By Wafer Thickness: Revenue Forecast (USD Million)

Table 34 Middle East & Africa Market, By Wafer Thickness: Volume Forecast (Units)

Table 35 Middle East & Africa Market, By Dicing Technology: Revenue Forecast (USD Million)

Table 36 Middle East & Africa Market, By Dicing Technology: Volume Forecast (Units)

Table 37 Middle East & Africa Market, By Country: Revenue Forecast (USD Million)

Table 38 Middle East & Africa Market, By Country: Volume Forecast (Units)

Table 39 South America Market, By Application: Revenue Forecast (USD Million)

Table 40 South America Market, By Application: Volume Forecast (Units)

Table 41 South America Market, By Wafer Thickness: Revenue Forecast (USD Million)

Table 42 South America Market, By Wafer Thickness: Volume Forecast (Units)

Table 43 South America Market, By Dicing Technology: Revenue Forecast (USD Million)

Table 44 South America Market, By Dicing Technology: Volume Forecast (Units)

Table 45 South America Market, By Country: Revenue Forecast (USD Million)

Table 46 South America Market, By Country: Volume Forecast (Units)

Introduction

Rapidly growing demand for portable communication and electronic devices such as smart phones, memory cards, smart card and other computing devices across the globe is expected to augment the demand for fabrication of miniature integrated circuit packages. Manufacturing of Wafer-level packaging and 3D integration usually require a significant reduction in wafer thickness. An increasing number of applications take advantage of this reduced size of wafer thickness. This in turn, is anticipated to boost the demand of thin wafer processing and dicing equipments at an exponential rate in the coming years.

Importance of processing and dicing thin wafers is increasing for a variety of different products and applications. The product roadmaps of many devices point towards increasing usage of thinner and ultra thin dies. Thereby, creating a better opportunity for various thin wafer processing and dicing equipment during the forecast period from 2017 to 2025. The global thin wafer processing and dicing equipment market is anticipated to witness an exponential growth rate in the coming years both in terms of value (USD Million) and Volume (Units).

Thin Wafer Processing and Dicing Equipment Market Size and Revenue Share
Thin Wafer Processing and Dicing Equipment Market Revenue Share
 

Market Dynamics

Increasing demand for smaller die and thinned wafer across various application sectors especially from the smart phone and smart card industry is the primary factor anticipated to foster the demand of thin wafer processing and dicing equipment market during the forecast period from 2016 to 2024. Thinned wafers are also increasingly used across various MEMS (Microelectromechanical Systems), memory and, logic devices and power devices among others as it offers reduced form factors along with better high heat dissipation and improved electrical performance. In addition, the current trend of miniaturization of devices having superior performance and lower cost of configuration is also anticipated to boost the demand of thinned wafers even below 100 µm and 50 µm. This factors, in turn is expected to drive the demand of technologically advanced thin wafer processing and dicing equipment in order to achieve desired miniaturization of semiconductor devices.

 

Segmentation Overview

Dicing Technology

Among the different dicing technology, the laser dicing technology is anticipated to witness the highest growth during the forecast period for 2017 to 2025. Laser dicing technology does not require any water and thus it offers the most suitable choice for dicing wafers required for various sensors. Moreover, Laser dicing is also used abundantly in combination with blade dicing for various applications.

Thickness of Wafer

Based on thickness of wafer, the thin wafer processing and dicing equipment market has been classified into 750 μm, 120 μm and 50 μm. Among the different thickness of wafer, though the 750 μm segment held the largest market share in 2016, the 750 μm of wafer thickness is expected to lose its dominance and is increasingly replaced by the 120 μm of wafer thickness owing to its increasing adoption across various RFID and power devices coupled with initiatives taken by various automotive manufacturers as a part of their social responsibility to reduce CO2 gas emission from automotives by interchanging the mechanical part with portable power electronic system in order to increase electrification in the cars.

Application Segment

In addition, different application segments including logic and memory, MEMs (Microelectromechanical Systems), power devices, RFID (Radio Frequency Identification) and CMOS (Complementary Metal Oxide Semiconductor) image sensors in which thin wafer processing and dicing equipments are majorly utilized has also been included within this scope of research. Moreover, depending on dicing technology, the market has been categorized into blade dicing equipment, laser dicing equipment and plasma dicing equipment. Each of the application segment and dicing technology has been further classified into wafer thickness in order to highlight which wafer size is majorly used in which application segments.

 

Regional Outlook

Geographically, Asia-Pacific region overshadowed the other regions thin wafer processing and dicing equipment market both in terms of revenue generation and growth and is expected to maintain its leading position throughput the forecast period. Wide concentration of various thin wafer processing and dicing equipment manufacturers in this region coupled with rapid investments and innovation activities taking place in this region in order to develop advanced equipments and to overcome the limitation of the existing equipment is the primary factor attributed to this regions high market share and growth.

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