Thin Wafer Processing and Dicing Equipment Market – Global Industry Analysis, Market Size Estimation and Growth Forecast By Wafer Size and Thickness (up to 50 micrometer, 51-120 micrometer and 121-750 micrometer), By Dicing Technology (Mechanical or Blade Dicing, Stealth Dicing, Plasma Dicing, Laser Dicing), By Application (CMOS Image Sensor, Radio Frequency Identification, Power Devices, Micro Electro Mechanical Systems, Logic Devices) & By Regions, 2017 – 2025

The Thin Wafer Processing and Dicing Equipment Market is predicted to grow during the research period from 2017 to 2025.

 
What Are the Driving Factors for Thin Wafer Processing and Dicing Equipment Market?

  • Growing application of ultra-thin wafers in different semiconductor devices
  • Growing usage of smart gadgets and other electronic devices which include smartphones, smart gadgets and other consumer electronics products
  • Rising adoption of power devices, sensors, microelectronics, MEMS
  • Increasing application of RFID chipsets, sensors, CMOS image sensors and detectors and power devices
  • Increasing focus on semiconductor device fabrication process

 

How Is The Market Segmented?
By Term Segments
By Wafer Size and Thickness Up to 50 micrometer, 51-120 micrometer and 121-750 micrometer
By Dicing Technology Mechanical or Blade Dicing, Stealth Dicing, Plasma Dicing, Laser Dicing
By Application CMOS Image Sensor, Radio Frequency Identification, Power Devices, Micro Electro Mechanical Systems, Logic Devices
By Regions Asia Pacific, North America, Middle East & Africa (MEA), Europe and Latin America

 

Who Are The Major Players In This Market?
Headquarters Corporations
The U.S. Lam Research Corporation, Plasma-Therm, LLC & others
Israel Advanced Dicing Technologies & others
China Suzhou Delphi Laser Co., Ltd. & others
Austria EV Group & others
Japan DISCO Corporation, Tokyo Electron Ltd., Panasonic Corporation, Tokyo Seimitsu Co. Ltd. & others
The U.K. SPTS Technologies Ltd. & others

 
Why Buy this Report?

  1. This report provides in-depth analysis of market determinant factors.
  2. This report analyzes market dynamics for each segment (such as Wafer Size and Thickness, Dicing Technology, Application, Regions ).
  3. This report provides 8 years forecast by analyzing push and pull factors affecting the dynamics of the market.
  4. This report provides application level cross-sectional analysis for each product type.
  5. This report provides regional level pricing trend analysis.
  6. This report acts as business decision support system by analyzing key trends in each market segment.
  7. This report provides insights regarding business strategies of leading market players.

Thin Wafer Processing and Dicing Equipment Market - Introduction

The Thin Wafer Processing and Dicing Equipment Market is projected to grow during the analysis period from 2017 to 2025. Dicing and processing of thin wafers have become an important part of the variety of different products and applications. Thin wafer processing, handling, and dicing are performed by temporary bonding to a rigid carrier wafer. After the backside processing, the thin wafer gets de-bonded from the carrier wafer. Then it is attached to a dicing tape on film frame for further processing. The growing demand of the communication devices like memory cards, smart card, smartphones and other different computing devices is driving the market for thin wafer processing and dicing equipment globally. The growing demand for standardization and growing application of sophisticated solutions for thin semiconductor devices for its manufacturing processes is stimulating the market for thin wafer processing and dicing equipment across different regions globally.

Report Overview
Aspect Details
Base Year of Estimation 2016
Value Estimation Year 2017
Forecast Period 2017 - 2025
Market Segmentations By Wafer Size and Thickness, Dicing Technology, Application, Regions
Regional Scope Asia Pacific, North America, Middle East & Africa (MEA), Europe and Latin America
Report Coverage Market Dynamics, Segmentation Overview and Competitive Landscape of the market

 

Market Dynamics

Growing application of ultra-thin wafers in different semiconductor devices is one of the prime driving factors for the market. Increasing usage of smart gadgets and other electronic devices which include smartphones, smart gadgets, and other consumer electronics products is fueling the market for wafer processing and dicing equipment globally. Additionally, increasing adoption of power devices, sensors, microelectronics, MEMS is some of the prime factors acting as drivers for the market. Increasing focus on semiconductor device fabrication process is another driving factor the market. Mechanical prevention from die cracking, chipping and other issues related to wafers are contributing to the positive development of the thin wafer processing and dicing equipment market globally. The demand for advanced and upgraded performance in low-cost solutions is driving the integration technology is fueling the usage of thin wafer processing and dicing equipment across different semiconductor industry. As the lithography nodes, die and wafer sizes shrink and the complexity of the devices increases, which require advance level fabrication technology for better productivity and defect detection. For these kinds of miniaturized and complex devices, thin wafer processing and dicing equipment is required.

Rising application of RFID chipsets, sensors, CMOS image sensors and detectors and power devices are fueling the application of thin wafer processing and dicing equipment in different semiconductor manufacturing industry. Technological complexities and high establishment cost of the equipment are some of the restraining factors for the market. However, increasing application of thin wafer processing and dicing equipment in research laboratory applications and increasing usage of different substrates for device manufacturing are some of the opportunities for the thin wafer processing and dicing equipment market.

 

Segmentation Overview

By wafer size and thickness the market for thin wafer processing and dicing equipment is segmented into up to 50 micrometers, 51 - 120 micrometers and 121 - 750 micrometer. By dicing technology the market is segmented into mechanical or blade dicing technology, stealth dicing technology, plasma dicing technology, and laser dicing technology. Moreover, the market is segmented into by application which includes CMOS image sensor, radio frequency identification, power devices, micro electro mechanical systems, logic devices among others.

By geography, the market has been segmented into Asia-Pacific, North America, Middle East & Africa (MEA), Europe and Latin America. In terms of revenue, Asia Pacific accounted for the largest market share of the thin wafer processing and dicing equipment market, followed by North America and Europe.

 

Competitive Landscape

Lam Research Corporation (The U.S.), Advanced Dicing Technologies (Israel), Suzhou Delphi Laser Co., Ltd. (China), EV Group (Austria), Plasma-Therm, LLC (The U.S.), DISCO Corporation (Japan), Tokyo Electron Ltd. (Japan), SPTS Technologies Ltd. (The U.K.), Panasonic Corporation (Japan) and Tokyo Seimitsu Co. Ltd. (Japan) among others are operating the thin wafer processing and dicing equipment market globally.

 

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